| 摘要 |
PROBLEM TO BE SOLVED: To provide a plating device to form a uniform plating film by smoothly feeding a jet of a plating solution ejected from a plating solution ejection pipe to a surface to be plated of a substrate, and implementing the uniform electrolysis on the surface to be plated. SOLUTION: This plating device comprises a cylindrical plating tank 12 to maintain a plating solution 10, a plating solution ejection pipe 18 which is connected to a center of a bottom part of the plating tank 12 to form a jet of the plating solution directed upward, a substrate holding part 14 to hold a substrate W in an attachable/detachable manner and to arrange the surface to be plated of a lower side of the substrate so as to be brought into contact with the jet of the plating solution 10, and an anode plate 16 arranged in the plating solution 10 in the plating tank 12. A flow straightening guide 32 which is expanded in a trumpet shape and extended upward along the streamline of the jet of the plating solution from an upper end of the plating solution ejection pipe 18 is arranged inside the plating tank 12.
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