THERMOPLASTIC RESIN COMPOSITION FOR HANDLING ELECTRONIC PART AND MOLDED ARTICLE FOR HANDLING ELECTRONIC PART

摘要

PROBLEM TO BE SOLVED: To provide a thermoplastic resin molded article for handling electronic parts, such as a carrier for magnetic heads (made of magneto-resistive elements), scarcely giving the parts electronic damage caused by electrostatic discharge, excessive conduction of a contact current, etc. SOLUTION: This thermoplastic resin composition used for molding an article for handling electronic parts comprises compounding 100 pts.wt. of a thermoplastic resin, such as polycarbonate resin, with 5-100 pts.wt. of carbon fiber and further with 1-100 pts.wt. of a polymeric antistatic agent, wherein the resin composition has an electrical surface resistance of 103 to 1012Ω. The molded article for handling electronic parts is obtained by molding the thermoplastic resin composition used for molding the article for handling electronic parts.