| 摘要 |
PROBLEM TO BE SOLVED: To obtain both a resin composition satisfying heat resistance electric characteristics, adhesiveness and moldability required for interlayer dielectrics, capable of forming a film having a low coefficient of thermal expansion and an adhesive film satisfying heat resistance, electric characteristics, adhesiveness and moldability required for interlayer dielectrics, capable of forming a film having a low coefficient of thermal expansion and excellent handleability. SOLUTION: This resin composition is obtained by compounding 1-99.9 pts.wt. of a polyquinoline resin with 0.1-95 pts.wt. of a bismaleimide compound of the formula (Ar1 is a bifunctional organic group containing at least two carbon atoms), 1-95 pts.wt. of whisker and 0-95 pts.wt. of another organic compound or inorganic compound so as to provide 100 pts.wt. total amount. This adhesive film can be obtained by removing an organic solvent from the resin.
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