| 摘要 |
<p>PROBLEM TO BE SOLVED: To improve reliability in airtightness and prevent breakage of wires in a chip support board. SOLUTION: A semiconductor device comprises a package board 2 for supporting a semiconductor chip 5, a measure-shaped cap member 6 for sealing the chip 5 while being jointed to the board 2, a sealing solder 7 for jointing the board 2 to the member 6, a cap-side metallized layer 6a provided on a joint surface 6b of the member 6 for jointing with the solder 7, and a board-side metallized layer 2a provided around the peripheral edge of the board 2 for jointing with the solder 7. The layer 6a has a width larger than that of the layer 2a, and a board-side joint surface 7b of the solder 7 for jointing with the layer 2a is arranged at a location, corresponding to the inner region of the surface 6b of the member 6 in the board 2, whereby the formation of cracks in the board 2 can be prevented.</p> |
