发明名称 SUBSTRATE TREATING DEVICE
摘要 <p>PROBLEM TO BE SOLVED: To provide a substrate treating device which can accurately position a substrate carried in the peripheral section treating unit from a coating unit. SOLUTION: A peripheral section treating unit, which removes an applied solution from the peripheral section of a substrate G after the solution is applied to the substrate G by means of a coating unit is provided with a stage 71, on which the substrate G is placed and a positioning mechanism 72, which positions the substrate G carried onto the stage 71. The positioning mechanism 72 positions the substrate G to a prescribed position by pushing the substrate G in both directions along the diagonal line of the substrate G, by means of a pair of rollers 81 which are attached to the Y-shaped front end section of the arm 82 of the mechanism 72, by nearly horizontally moving the arm 82 through the means of a horizontally moving mechanism 84.</p>
申请公布号 JP2001044118(A) 申请公布日期 2001.02.16
申请号 JP20000145543 申请日期 2000.05.17
申请人 TOKYO ELECTRON LTD 发明人 SAKAI MITSUHIRO;TANAKA YUKINOBU;HONDA YOICHI;SHIMOMURA YUJI
分类号 B65G49/06;G02F1/13;H01L21/00;H01L21/027;H01L21/68;(IPC1-7):H01L21/027 主分类号 B65G49/06
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