| 摘要 |
PROBLEM TO BE SOLVED: To avoid the irregularity of a temperature by installing a blow nozzle at the tip of a blast pipe and installing a reflow soldering device on the transportation conveyor of a wiring board so that electronic parts can locally and preliminarily be heated. SOLUTION: A board obtained by mixing/loading a thick and large electronic part, 2 and small electronic parts 3 on a wiring board 1 is transported by the conveyor of a preceding process and it is transported to a prescribed position. An atmosphere in a box 5 is heated by a heater, a fan 8 is turned by the driving of a motor 7, a setting temperature atmosphere 6 is generated and the hot air of atmosphere gas and air is sent into a flexible blast pipe 9 by the force of the motor 7 and the fan 8. Then, hot air is sprayed to the electronic parts 2 or 3 on the wiring board 1 in a prescribed position from the blow nozzle 11 which is previously fitted to an arm 10 and they are locally and preliminarily heated.
|
