| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing an inner layer circuit board for making it difficult to generate any failure of the circuit. SOLUTION: After a coppered laminated board 1 is shaped, washed, and dried, a dry film resist 2 to be an etching resist is laminated on the surface of a copper coil 3 in this method for manufacturing an inner layer circuit board. Then, the drying after the washing is carried out in a gaseous nitrogen atmosphere. Thus, the drying after the washing can prevent the copper foil 3 from being oxidized, and make it difficult to be dissolved in etching liquid. Therefore, it is possible to prevent the necessary part of the copper foil 3 from being etched at the time of forming the circuit. |
