| 摘要 |
PROBLEM TO BE SOLVED: To provide a polishing apparatus which can realize ultra-accurate flat processing and mirror processing of a semiconductor wafer having an enlarged diameter, for simplifying the structure of an indexing table, and facilitating electrical connection. SOLUTION: This polishing apparatus includes a supply cassette mount base 3, a supply cassette 4, a work feed-in robot 5, a work receiving water bath 6, a transfer means 7 for transferring the work receiving water bath, an indexing table 8 erected on a base, four spindle shafts 9 carried at four corners of the indexing table, work heads 10 provided below the respective spindle shafts, three sets of polishing tables 11, a shooter 12 for transferring a semiconductor wafer to accommodate it in an accommodation cassette, an accommodation cassette 13, and an accommodation cassette mount base 14. The rotation of the indexing table is restricted to 270 degrees or less. |
