| 摘要 |
PROBLEM TO BE SOLVED: To provide highly reliable high frequency components which are superior in shock resistance and heat resistance. SOLUTION: In an IC chip 10, a substrate 10 supports an IC circuit. A power terminal, a signal input/output terminal, a GND terminal and dummy terminals 13 are installed on one face 11 of the substrate 10 and constitute bumps. The dummy terminals 13 are electrically independent of the power terminal, the signal input/output terminal and the GND terminal, the IC chips are mounted on the main surface of a dielectric substrate 20 by bump connection, and high frequency components are constituted. |
