发明名称 Method for etching a dielectric layer over a semiconductor substrate
摘要 A wet etch bath (61) holds a wet etchant (52) for etching a dielectric over a semiconductor substrate. The wet etch bath (61) has a tub (63) separated from a reservoir (64) by a wall (65). The tub (63) is filled with the wet etchant (52) to a height of the wall (65). The reservoir (64) is filled with the wet etchant (52) to a height less than the height of the wall. A pump (66) coupled to the reservoir (64) pumps the wet etchant (52) through an osmotic membrane degasifier (69) to the tub (63). Adding the wet etchant (52) to the tub (63) causes the wet etchant (52) to cascade over the wall (65) back to the reservoir (64). The osmotic membrane degasifier (69) reduces a concentration of a reactive agent in the wet etchant (52).
申请公布号 US6187216(B1) 申请公布日期 2001.02.13
申请号 US19970917982 申请日期 1997.08.27
申请人 MOTOROLA, INC. 发明人 DRYER PAUL WILLIAM;DAVISON MICHAEL J.;DYRSTEN RALPH A.
分类号 H01L21/306;H01L21/00;H01L21/311;(IPC1-7):C03C15/02 主分类号 H01L21/306
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