发明名称 HEAT PUMP
摘要 PROBLEM TO BE SOLVED: To provide a heat pump to be high in COP and formed in a compact configurations. SOLUTION: This heat pump HP1 comprises a booster 260 to boost a refrigerant, a first heat-exchanger 220 to heat fluid on the high heat source side by the heat of condensation of the refrigerant boosted by the booster 260, a second heat-exchanger 320 situated in a spot situated upper stream of a flow of fluid on the high heat source side from the first heat-exchanger 220 and heating fluid on the high heat source side by the sensible heat of refrigerant liquid, a third heat-exchanger 310 situated in a route for fluid on the low heat source side and formed in a manner to cool the fluid on the low heat source side by the sensible heat of the refrigerant liquid and a fourth heat-exchanger 210 situated in a route for the fluid on the low heat source side and in a spot situated downstream of the fluid on the low heat source side from the third heat-exchanger 310 and cooling the fluid on the low heat source side by the evaporation heat of a refrigerant boosted by the booster 260. Between the second and third heat- exchangers 320 and 310, heat is pumped up from the fluid on the low heat source side formed such that refrigerant liquid is circulated to the fluid on the high heat source side. This constitution performs heat-exchange between the fluid on the low heat source side and the fluid on the high heat source side with high efficiency.
申请公布号 JP2001041494(A) 申请公布日期 2001.02.13
申请号 JP19990210266 申请日期 1999.07.26
申请人 EBARA CORP 发明人 MAEDA KENSAKU;FUKASAKU YOSHIRO
分类号 F24F3/147;F24F3/14;F28D20/00;(IPC1-7):F24F3/147 主分类号 F24F3/147
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