发明名称 EPOXY RESIN COMPOSITION AND RESIN SEALING TYPE SEMICONDUCTOR APPARATUS
摘要 PROBLEM TO BE SOLVED: To obtain the subject composition having low viscosity, excellent high fluidity and bond strength of cured material by making the composition include a glycidyl ether-based epoxy resin and a glycidylamine-based epoxy resin. SOLUTION: This composition comprises (A) a glycidyl ether-based epoxy resin (except one having a glycidylamine structure) obtained by subject a tri- or polyhydric phenol such as a tris(hydroxyphenyl)alkane to a glycidyl formation reaction and (B) a glycidylamine-based epoxy resin preferably obtained by subjecting an aromatic amine (e.g. aminophenol, etc.), to a glycidyl formation reaction. In the composition, 1-400 pts.wt. of the component A is preferably used based on 100 pts.wt. of the component B. The composition may contain an epoxy resin curing agent [e.g. tris(hydroxyphenyl)alkane, etc.], if required.
申请公布号 JP2001040067(A) 申请公布日期 2001.02.13
申请号 JP19990212055 申请日期 1999.07.27
申请人 SUMITOMO CHEM CO LTD 发明人 NAKAJIMA NOBUYUKI;SAITO NORIAKI
分类号 C08L63/00;C08G59/32;C08G59/40;H01L23/29;H01L23/31;(IPC1-7):C08G59/32 主分类号 C08L63/00
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