| 摘要 |
PROBLEM TO BE SOLVED: To provide a grinding device for accurately measuring the coat thickness of a material to be ground after washing. SOLUTION: This grinding device is provided with a grinding part 30 for grinding the surface to be ground of a semiconductor substrate 1, and a washing part 40 provided with washers 7, 8, and 9 for rotating and washing the substrate 1 after grinding. The device is provided with a position aligning means for detecting the reference position (a notch or an orientation flat) of the substrate 1 by a sensor provided on the washer 7, and aligning the reference position at the time of finishing washing the substrate 1 by a detected signal, and a coat thickness measuring apparatus 70 installed in the after stage of the washers 7, 8, and 9 to measure the coat thickness of the surface to be ground of the substrate 1 aligned its position by position aligning. |
