发明名称 APPARATUS AND METHOD FOR MOUNTING ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To highly accurately and quickly mount various types of electronic components on a printed substrate. SOLUTION: A line sensor 55 for detecting electronic components 56a to 56c sucked by suction nozzles 46a to 46c is provided. When the sucked components do not require much mounting accuracy, line light 53 is used to illuminate the components, and the line sensor 55 receives the light to recognize the components. On the other hand, when mounting accuracy is required, the components are illuminated from above, the line sensor 55 is moved to below the components and the components are scanned, thereby recognizing the components. In such a constitution, since the components can be recognized in varying recognition methods by the sensor or a component recognizing means provided on a suction head, various components can be recognized while the head moves the sucked components to a printed substrate by the suction nozzles, thereby largely improving tact time for mounting components.
申请公布号 JP2001036299(A) 申请公布日期 2001.02.09
申请号 JP19990206702 申请日期 1999.07.21
申请人 JUKI CORP 发明人 OZAWA MASATO;NAGAI TOSHIAKI
分类号 H05K13/08 主分类号 H05K13/08
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