摘要 |
PROBLEM TO BE SOLVED: To shorten a signal path by connecting circuit elements which includes amplifying elements and input/output terminals to a board, and locating a heat sink for radiating heat produced by the amplifying elements, between a power source and the board. SOLUTION: A plurality of power transistors 8, which are amplifying elements, are located relatively close to the surface of a printed board 7 which is opposite to a rear panel 3. In order to dissipate heat from these transistors 8, the transistors 8 are attached to one surface of a heat conducing plate 9 made of copper, and a heat sink 11 is attached to the other surface of the plate 9. Additionally, a power source 20 is provided on the side of a front panel 16. According to this construction, during the time in which a signal applied to a pin jack 4 arranged on the board 7 is amplified by the transistors 8 and then outputted from speaker terminals 5 and 6, the signal travels only along the board 7, without travel along an unnecessary roundabout.
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