| 摘要 |
PROBLEM TO BE SOLVED: To prevent the outflow of sealing resin, and to realize the miniaturization of a semiconductor device by arranging a sealing dam in a narrow space, and ensuring the height of the sealing dam. SOLUTION: This semiconductor device is provided with a substrate 1 for loading a semiconductor chip, a semiconductor chip 2 loaded on the substrate 1 for loading the semiconductor chip, and a sealing member 4 for sealing semiconductor chip terminal parts 3. In this case, a recessed part (7) is formed on the first face of the substrate 1, wiring is formed on the first face of the substrate 1, sealing dams 8 are formed on the first face of the substrate 1, and the semiconductor chip 2 is positioned on the substrate 1 while the semiconductor chip terminal part 3 are positioned in the recessed part (7). The sealing member 4 is formed in the recessed part (7), the wiring formed on the first face of the substrate 1 includes outer connection 6c and inner connection 6a, and the sealing dams 8 are formed in a region from the outside of the recessed part to the inside of the recessed part of the peripheral part of the recessed part.
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