发明名称 CHIP TYPE SURGE ABSORBER (1)
摘要 PROBLEM TO BE SOLVED: To increase surge resistant amount and decrease discharge delay by installing a connecting surface to enlarge a connecting area in the connecting part of the specified number of discharge electrodes, which are electrically connected to terminal electrodes and installed within an airtight chamber together with a discharge gap, and the terminal electrodes. SOLUTION: An insulator sheet 7 is divided into plural numbers to obtain insulating substrates 11. Dividing grooves 8, 9 are formed on the surface for forming a discharge electrode 12 of the insulator sheet 7. The dividing groove 8 in one direction is formed in a free shape for facilitating dividing. The dividing groove 9 in the other direction is formed in a V shape so as to easily form the discharge electrode 12 since a connecting surface 16 is formed. A 1μm thick conductive film acting as the discharge electrode 12 is formed. The discharge electrode 12 has 2 to 5 pairs of wide line shapes and is formed also on the connecting surface 16. Next, an airtight cap 13 is placed on the insulating substrate 11. After adhesion of the airtight cap 13, the insulator sheet 7 is divided along the dividing grooves 8, 9. After dividing of the insulator sheet 7, terminal electrodes 14 are formed.
申请公布号 JP2001035633(A) 申请公布日期 2001.02.09
申请号 JP19990210500 申请日期 1999.07.26
申请人 MITSUBISHI MATERIALS CORP 发明人 TANAKA YOSHIYUKI;KITAHARA NAOTO;SHIYATOU YASUHIRO;HARADA KOICHIRO;INABA HITOSHI;RIYUU HEISEN
分类号 H01T4/12;H01T4/10;(IPC1-7):H01T4/12 主分类号 H01T4/12
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