HEAT PLATE FOR ELECTRONIC COMPONENT TESTER

摘要

PROBLEM TO BE SOLVED: To provide a heat plate capable of reducing a temperature rise time even in the case of an electronic component such as a BGA(ball grid array) type IC. SOLUTION: This heat plate 106 is fixed on a heat generation body 107 and constituted to hold an IC to be tested. When the IC is mounted on the heat plate 106, a space is formed by the IC, the heat generating body 107 and the heat plate 106. A far infrared radiation layer 1065 emitting far infrared radiation is formed on the surface of the heat plate 106 which is in contact with the space.