METHOD FOR PRODUCING VIA-CONNECTIONS IN A SUBSTRATE AND SUBSTRATE EQUIPPED WITH SAME

摘要

The invention concerns a method for producing conductive via-connections in a substrate and substrates equipped with such connections. The method for producing conductive via-connections between the front face (2) and the rear face (3) of a substrate consists in: producing in the substrate (1) on the side of the rear face (3), cavities (5) with predetermined depth and cross-section for defining pads (4) with specific cross-section designed to ensure electrical conduction between the two faces (2, 3) and filling up the cavities (5) with a dielectric material (7). The substrate is equipped with conductive via-connections between its front face (2) and its rear face (3). The conductive connections are provided by the pads (4) defined by the cavities (5) filled with a dielectric material (7). The invention is particularly applicable to substrates used for making microsensors.