Chip component, useful for a memory chip stack, has chip contact pads connected through an adhesive dielectric strip to mounting element conductor lines and solder balls connected to mounting element contact vias

摘要

A semiconductor chip component, comprising chip contact pads connected through an adhesive dielectric strip to mounting element conductor lines and solder balls connected to mounting element contact vias, is new. A semiconductor chip component comprises: (a) a chip mounting element with contact vias connected to conductor lines; (b) a chip with contact pads; (c) a dielectric strip element for adhesively bonding the chip onto the mounting element; (d) a conductor unit for electrically connecting the chip contact pads and the conductor lines; and (e) solder balls provided on the mounting element and respectively aligned and connected with associated contact vias in the mounting element. An Independent claim is also included for a semiconductor chip stack with upper and lower chip components as described above.