发明名称 Plate making device and method
摘要 <p>A plate making device and method, wherein when a light sensor detects that the stencil plate inserted into the plate making device is provided with the through hole, the controller supplies a current to the thermal head for T1 seconds to control the heat time to be short, so that the perforation energy of the thermal head is reduced. On the other hand, when the light sensor detects that the stencil plate has no through hole, the controller supplies a current to the thermal heat for T2 seconds longer than T1 seconds to control the heat time to be long, so that the perforation energy of the thermal head is increased. In this device, even when any type of stencil plate is used, the plate making process providing the best print quality for each stencil plate can be performed. <IMAGE></p>
申请公布号 EP0650830(B1) 申请公布日期 2001.02.07
申请号 EP19940307970 申请日期 1994.10.28
申请人 BROTHER KOGYO KABUSHIKI KAISHA 发明人 MIKI, TAKASHI;OKUMURA, TAKASHI
分类号 B41L13/02;B41C1/055;B41C1/14;B41L13/18;B41N1/24;(IPC1-7):B41C1/14 主分类号 B41L13/02
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