发明名称 PASSIVE ELECTRONIC PARTS, IC PARTS, AND WAFER
摘要 The present invention relates to a passive electronic part comprising a substrate 1 and a passive circuit 2. The substrate 1 is provided with an inorganic insulating layer 11 constituted of a composition achieved by mixing a ceramic constituent and a glass constituent. The passive circuit 2, which is normally constituted of a conductor pattern, is provided on one surface 111 of the inorganic insulating layer 11. It is desirable that the surface 111 of the inorganic insulating layer 11 where the passive circuit 2 is formed be polished. An electronic part with which the conductor pattern can be made finer and a design can be implemented based upon a small pattern area is provided. <IMAGE>
申请公布号 EP1014443(A4) 申请公布日期 2001.02.07
申请号 EP19970940456 申请日期 1997.09.22
申请人 TDK CORPORATION 发明人 HAYASHI, KATSUHIKO
分类号 H01L23/15;H01L23/495;H01L23/64;H01L23/66;H03H7/01;H03H7/06 主分类号 H01L23/15
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