IMPROVED LEADFRAME STRUCTURE WITH LOCKED INNER LEADS AND PROCESS FOR MANUFACTURING SAME

摘要

An improved leadframe structure and process of manufacturing the same are provided. The leadframe includes a plurality of leads with inner portions extending toward an IC bonding pad within an IC encapsulation area. A polymer structure having a preselected configuration is provided to interlock the inner portions of the leads to prevent lateral, torsional and vertical displacement thereof during the IC packaging process, thus improving yield and reducing packaging cost.