Wire bonding method

摘要

A method for connecting first and second bonding points with a bonding wire that passes through a capillary comprising the steps of: bonding a ball formed at the end of the wire protruding from the capillary to the first bonding point; raising the capillary; moving the capillary toward the second bonding point so that the capillary is first lowered to a point that is slightly on the first bonding point side of the second bonding point, and a portion of the wire suspended from the capillary is pressed against a horizontal surface located between the first and second bonding points; raising and moving the capillary to a point above the second bonding point, and lowering the capillary so as to bond the wire to the second bonding point.