| 摘要 |
PROBLEM TO BE SOLVED: To provide a plate for transferring a film substrate and a method for transferring it, capable of transferring the film substrate in a relatively simple structure and in an optimum state. SOLUTION: A film substrate 7 is covered with a plate 6 having an electronic component relief hole 15 capable of relieving an electronic component 9 when the film base 7 which has a chip-like electronic component 9 mounted on the surface thereof is covered with the plate 6, positioning means (positioning holes 11 and positioning pins) for determining the positioning of the film substrate 7, and holes 17 for suction, which correspond to a planar portion of the film substrate 7. The film substrate 7 is sucked by vacuum from the surface side of the plate 6 through the suction holes 17 and is brought into close contact with the rear face of the plate 6, thereby transferring the plate 6 and the film base 7 in an integrated state.
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