| 摘要 |
PROBLEM TO BE SOLVED: To provide a polyimide precursor resin composition and a manufacturing method for a pattern capable of eliminating protruding portions of a pattern edges of a polyimide resin film without using methods such as dry etching, etc. SOLUTION: This polyimide precursor resin composition includes (A) a polyimide precursor resin soluble in aqueous alkali solution and (B) a compound expressed by formula I (X is a single bond or a divalent functional group; R1 and R2 are each an independent alkyl group; a and b are each an independent integer of 0-3). A polyimide pattern is produced by coating/hardening the polyimide precursor resin composition on a substrate 1, applying a positive type resist as a masking material, applying a wet etching process to the polyimide precursor resin composition by an alkaline aqueous solution, peeling off the positive type resist and the heat processing. |
