| 摘要 |
<p>A precision cutting apparatus including a cutting tool which consists of at least a single flexible cutting element and means coacting with said cutting element for holding it in a rigid, unstressed condition is disclosed. The flexible cutting element is ordinary spring steel while the means for holding the cutting element in a rigid, unstressed condition is a block of dimensionally-stable pyrolytic graphite containing a groove in which the spring steel cutting element is receivable. Also disclosed, is translation means for applying rectilinear motion to the cutting tool, and a means for aligning the work piece relative to the cutting tool. The grooved graphite block, in addition to providing a dimensionally stable holder, also provides a porous material into which an adhesive may be introduced to retain the cutting element within the grooves. Heating the graphite block liquefies an appropriate adhesive and permits the removal of an old cutting element and its replacement with a new cutting element. A method of operating the cutting apparatus is also shown including an alignment step which permits extremely precise cutting. The apparatus and method taught have particular utility in the semiconductor area where the ability to dice with great precision, for example, greatly enhances the yield of usable semiconductor chips.</p> |
