发明名称 |
Sputter target assembly having a metal-matrix-composite backing plate and methods of making same |
摘要 |
A method of producing a sputter target assembly including a metal target attached to a metal-matrix-composite backing plate and sputter target assemblies made thereby. The method includes hot isostatically pressing a silicon carbide-aluminum powder composition to form a backing plate while simultaneously bonding the powder composition to a metal target to form a diffusion-type bond between the target and the backing plate such that the target assembly possesses extremely high resistance to warpage at high operating temperatures. A second embodiment of the sputter target assembly includes an annular sealing member of machined aluminum disposed in the backing plate around the target.
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申请公布号 |
US6183686(B1) |
申请公布日期 |
2001.02.06 |
申请号 |
US19990365919 |
申请日期 |
1999.08.03 |
申请人 |
TOSOH SMD, INC. |
发明人 |
BARDUS STEVEN L.;QAMAR SOHAIL S.;BANSAL ANURAG |
分类号 |
B22F7/08;C23C14/34;(IPC1-7):B22F3/14;B22F7/04 |
主分类号 |
B22F7/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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