| 摘要 |
PROBLEM TO BE SOLVED: To provide a cup type plating method capable of embodying a plating treatment which has a high uniformity and good appearance even when a wafer coated with a metal seed easily soluble in a plating liquid is subjected to the plating treatment. SOLUTION: This cut type plating method consists in executing the plating treatment by supplying the plating liquid in ascending flow from below a plating tank to the surface to be plated of the wafer with the metal seed placed on the upper part of the plating tank and supplying plating current to the wafer with the metal seed while discharging the plating liquid from a plating liquid discharge path disposed in the plating tank. In this case, the plating treatment is executed by impressing voltage for preventing the dissolution of the metal seed of the surface to be plated simultaneously when the plating liquid comes into contact with the surface to be plated and starting the supply of the plating current after the entire surface of the surface to be plated attains the state in contact with the plating liquid.
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