| 摘要 |
<p>The invention concerns a method for making an integrated circuit device comprising contact pads, said device being of the smart card type with reduced format compared to standard smart cards. The invention is characterised in that it comprises the following steps: transferring a first integrated circuit chip (1) onto a support strip (15, 18) comprising contact pads (14); transferring a second integrated circuit chip (2) onto the first chip (1), interconnecting the chips (1, 2) mutually and to the contact pads (14) so as to form a micromodule; protecting the integrated circuit chips (1, 2) and their connections (17) with an insulating material (8) forming a second face (40) of the device; obtaining the device (100) by cutting out the micromodule at the periphery of the contact pads (14) forming the first face (30).</p> |
