发明名称 METHOD FOR MAKING SMART CARD WITH REDUCED FORMAT
摘要 The invention concerns a method for making an integrated circuit device comprising contact pads, said device being of the smart card type with reduced format compared to standard smart cards. The invention is characterised in that it comprises the following steps: transferring a first integrated circuit chip (1) onto a support strip (15, 18) comprising contact pads (14); transferring a second integrated circuit chip (2) onto the first chip (1), interconnecting the chips (1, 2) mutually and to the contact pads (14) so as to form a micromodule; protecting the integrated circuit chips (1, 2) and their connections (17) with an insulating material (8) forming a second face (40) of the device; obtaining the device (100) by cutting out the micromodule at the periphery of the contact pads (14) forming the first face (30).
申请公布号 WO0108092(A1) 申请公布日期 2001.02.01
申请号 WO2000FR02047 申请日期 2000.07.13
申请人 GEMPLUS;BOCCIA, HENRI;BRUNET, OLIVIER;PATRICE, PHILIPPE;LIMOUSIN, ISABELLE 发明人 BOCCIA, HENRI;BRUNET, OLIVIER;PATRICE, PHILIPPE;LIMOUSIN, ISABELLE
分类号 G06K19/077;H01L23/538;H01L25/065 主分类号 G06K19/077
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