| 摘要 |
A TDI sensor (20) obtains images of a plurality of areas (T) with the same pattern on an object of inspection such as a semiconductor wafer (W), and the obtained images are stored in an image storage part (52). The plurality of areas (T) are designated in pairs, and an image comparison part (54) compares the images of the areas in each pair to detect a suspected pair including at least one possible defective area. A CPU (56) compares the images of the areas in the suspected pair with images of areas in other pairs to thereby find which area in the suspected pair is defective. <IMAGE> |
