发明名称 |
Infrared detector array with microbridge stucrure |
摘要 |
<p>A thermal type infrared ray detector with a thermal separation structure includes a plurality of picture elements. Each of the plurality of picture elements includes a circuit formed in a substrate for every picture element, and a light receiving section converting infrared rays into change of a resistance or a charge quantity. The circuit generates a voltage signal from the resistance change or the charge quantity change. Beams mechanically support the light receiving section from the substrate to form a gap between the light receiving section and the substrate, and electrically connect the light receiving section to the circuit. Each of the beams includes a wiring line film formed of Ti alloy and connecting the light receiving section to the circuit, and a protective insulating film surrounding the wiring line film. In this case, the Ti alloy may be TiAl6V4. <IMAGE></p> |
申请公布号 |
EP1072875(A1) |
申请公布日期 |
2001.01.31 |
申请号 |
EP20000115041 |
申请日期 |
2000.07.25 |
申请人 |
NEC CORPORATION |
发明人 |
KAWANO, KATSUYA;ODA, NAOKI |
分类号 |
G01J1/02;G01J1/42;G01J5/20;G01J5/34;H01L27/14;(IPC1-7):G01J5/34 |
主分类号 |
G01J1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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