| 摘要 |
PROBLEM TO BE SOLVED: To ensure cut lapping quality by supplying a lap suspension to a circulating system including a storage tank, a pump, a nozzle and a collecting vessel during lapping. SOLUTION: A fresh lap suspension is uniformly supplied to a circulating system over the whole time of cut lapping. The lap suspension is preferably intermittently supplied to the circulating system during lapping. The fresh lap suspension put in an external storage tank is supplied to the circulating system through a valve. The fresh lap suspension may be supplied from an optional position to the circulating system. However, the fresh lamp suspension is preferably supplied to the storage tank of the circulating system. The fresh lamp suspension is totally supplied to the circulating system in an amount of, preferably, 2-40% of the total volume of the lap suspension, particularly preferably 20-30%. According to this, a highly valuable semiconductor wafer having a geometric shape can be manufactured. |
