发明名称 |
Resin compositions for electric circuit boards |
摘要 |
A resin composition which increases the copper peeling strength and improves the dielectric properties of electric circuit boards is disclosed. The resin composition comprises: (a) 20-100 parts by weight of a syndiotactic polystyrene, (b) 1-40 parts by weight of a functionalized syndiotactic styrene-based copolymer having microfoaming when being cured, (c) 1-40 parts by weight of an epoxy-styrene copolymer, and (d) 0-40 parts by weight of an additive.
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申请公布号 |
US6180725(B1) |
申请公布日期 |
2001.01.30 |
申请号 |
US19990363874 |
申请日期 |
1999.07.29 |
申请人 |
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE |
发明人 |
TSAI HSIEN-YIN;CHEN IN-MAU;KUO WEN-FAA |
分类号 |
C08F8/00;C08L25/06;C08L25/14;C08L63/00;H01L23/14;H05K1/03;(IPC1-7):C08F283/06 |
主分类号 |
C08F8/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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