| 摘要 |
PROBLEM TO BE SOLVED: To eliminate the fact where projected warpage caused in the direction that links an optical semiconductor device with an optical fiber is returned to the lower side of a substrate by fixing with screws so as not to put the positional alignment of the device with the fiber out of order due to fixing with screws. SOLUTION: This package is formed into a structure, where the package has an almost rectangular base body 1 having a mounting part 1, which is mounted with an optical semiconductor device 4 on its upper surface, and a frame 2 which is bonded to the base body 1 in such a way as to encircle the mounting part 1a, is provided with an optical fiber fixing member 8 for fixing an optical fiber 12, which is optically coupled with the device 4 on the side part of the frame 2 and is provided with lead terminals 11 for inputting a drive signal in the element 4 on the other side part of the frame 2, and screwing parts 15 are respectively provided in the center part of each long side of the base body 1, in such a way as to project to the outside.
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