Pin soldering enhancement and method

摘要

A multi-layer circuit board includes several metallic layers. Each metallic layer includes a metallic ring surrounding a component pin hole formed through each layer of the board. The ring is isolated from its respective metallic layer by a concentric gap formed of non-metallic material. A plurality of metallic traces interconnect each ring with its respective metallic layer. The traces extend radially outwardly from the ring and segment the gap. Each trace has a width of about 0.010 mils and a length of about 0.050 mils.