| 摘要 |
PROBLEM TO BE SOLVED: To provide a grinding wheel which is provided with a grinding wheel solidified by a base material relatively weak in strength such as sodium alginate on an outer circumference of a circular substrate, and withstands the high-speed rotation during the grinding operation. SOLUTION: In this grinding wheel, a recessed part to hold a grinding wheel is formed on an outer circumferential end part of a circular substrate along the circumferential direction. A grinding wheel 2 is arranged in a ring while the grinding wheel 2 is embedded in the recessed part 1a of the circular substrate 1 except an outer circumferential end face. The grinding wheel 2 is formed of the abrasive grains mainly consisting of silicon dioxide and solidified by sodium alginate, or solidified by the electrophoresis method, and arranged in the recessed part 1a through an adhesive. A work is particularly a semi-conductor wafer, and its outer circumference is engaged with a grinding groove 2a provided in the outer circumferential end face for grinding. The work is ground while rotating the grinding wheel 6 and the work.
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