发明名称 Device for attaching a heat sink
摘要 A device for attaching a heat sink having a first and a second surface to an element generating heat in an electronic system, which element has an upper plane side contacting the first surface of the heat sink and a lower connector side connected to a printed circuit board, comprises a pair of holes formed on the upper plane side of the element at both sides of the heat sink attached to the element, a clip attached to the second surface of the heat sink having two hooked ends respectively connected with the pair of holes, a lever hinged to the clip, and a support hinged to the lever, wherein the lever is swung so as to cause the support to press or release the heat sink against or from the element. Preferably, the clip has a lever holding seat to hold a first fixing lug formed on the lever swung to cause the support to press the heat sink, thereby preventing the lever from inadvertent reverse swing. In addition, the clip may have a stopper to limit the swing of the lever for releasing the heat sink from the element, and the lever has additionally a second fixing lug resiliently fixed onto the lever swung to release the heat sink from the element.
申请公布号 US6181559(B1) 申请公布日期 2001.01.30
申请号 US19990358586 申请日期 1999.07.21
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 SEO YEOL-GU
分类号 H05K7/20;H01L23/40;(IPC1-7):H05K7/20 主分类号 H05K7/20
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