| 摘要 |
PROBLEM TO BE SOLVED: To enable the misalignment of a flip-chip connection to be evaluated to an accuracy of the order of microns to submicrons without using a large and expensive equipment, where the accuracy of the order of micron to sub- micron must be required in the near future. SOLUTION: This evaluation method is used to evaluate misalignment of a bonding which is carried out to bond an integrated circuit chip to a board (multi-chip module, dissimilar integrated circuit chip or the like) in a flip-chip connection manner, where the resistance of a fine wire resistor is evaluated, and an alignment accuracy is obtained resting on a change in resistance. The resistance of the fine wire resistor of an evaluating chip connected to a board in a flip-chip connection manner is measured, with which the misalignment of the chip from the board can be very accurately evaluated. With the use of a fine wire resistor of width of size of one micron or so, a misalignment volume of submicrons can be evaluated. |
