发明名称 HEAT SINK
摘要 PROBLEM TO BE SOLVED: To provide a heat sink, which can dissipate heat very efficiently and is easily formed as well as being miniaturized. SOLUTION: This heat sink is provided with a heat conductor 12 mounted with electronic elements 10, which are accompanied by a heat generation, piezoelectric vibrators 16 to curve the heat conductor 12 provided in a prescribed range on the surface, where is not mounted with the element 10, of this conductor 12 and a driving means to make the vibrators 16 take expansion and contraction actions. The conductor 12 is tabularly formed and the vibrators 16 are laminated on both surfaces in the prescribed range of the conductor 12.
申请公布号 JP2001028418(A) 申请公布日期 2001.01.30
申请号 JP19990200314 申请日期 1999.07.14
申请人 HOKURIKU ELECTRIC IND CO LTD 发明人 OBARA YOZO
分类号 H01L23/467;H01L23/36;(IPC1-7):H01L23/467 主分类号 H01L23/467
代理机构 代理人
主权项
地址