| 摘要 |
PROBLEM TO BE SOLVED: To realize a structure of head assembly in which information signals can be transferred at a high speed and which can be realized by the present manufacture technique. SOLUTION: A head IC chip 60 has an integrated circuit part, a wiring pattern, head slider connection electrodes 65-68 and suspension connection electrodes 70-73 formed to a surface 62 alone, and as a larger size than a head slider 40. The head slider 40 has a magnetic head 42 and electrodes 43a-46a. The head slider 40 is bonded to the surface 62 of the head IC chip 60 in a state without covering the head slider connection electrodes 65-68 and suspension connection electrodes 70-73. The rear face of the head IC chip 60 is bonded to a gimbals part 81 of a suspension 80. The head slider 40 and the head IC chip 60, and the head IC chip 60 and the suspension 80 are respectively electrically connected at an outer part than the head slider 40.
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