| 摘要 |
<p>PROBLEM TO BE SOLVED: To prevent the occurrence of disconnection in a bending area at the time of bending and mounting by forming the thickness of the aluminum foil wiring of the bending area to be thinner than that of an electronic parts mounting area. SOLUTION: An aluminum foil wiring 12 formed of aluminum foil is sandwiched by polyimide resin layers 11 and 13 formed of flexible resin, polyimide resin, for example, and an aluminum foil wiring 15 is sandwiched by polyimide resin layers 13 and 14. An electronic component mounting area C for mounting various electronic components and a bending area D at the time of mounting the component on an electronic unit are integrally constituted. In the bending area D, the thicknesses of the aluminum foil wirings 12 and 15 are formed to be thinner than those of the electronic parts mounting area C. Thus, the resistance of disconnection at the time bending when the component is mounted improves.</p> |
