| 摘要 |
PROBLEM TO BE SOLVED: To provide a socket making electrical contact by electrically connecting a plurality of contact parts separately installed on an anisotropic conductive sheet with contact pins, and bringing into contact with an electrode of a semiconductor device. SOLUTION: Plural contact parts 4 are separately installed on an anisotropic conductive sheet 3 and individually come in contact with an electrode 1 of a semiconductor device. Even when the anisotropic conductive sheet 3 is brought into contact with the recessed electrode 1 of the semiconductor device, application of excess pressing force to between the anisotropic conductive sheet 3 and the semiconductor device is made unnecessary, and damage to the anisotropic conductive sheet 3 and the semiconductor device can be avoided. Since a conductive surface 4b is formed on the contact surface of the contact parts with the electrodes 1, even if coplanarity is bad, dispersion of intervals between electrodes 1 in the semiconductor device is offset, and contact of the contact parts 4 with the electrodes 1 is ensured.
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