| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a package substrate which allows a high capacitance capacitor to be disposed in the vicinity of an IC chip. SOLUTION: Since a capacitor for power composed of a metallic substrate 12 is disposed immediately under an IC chip 70, a distance between the IC chip and the capacitor becomes short and thereby loop inductance can be reduced. A through hole 268 for connecting to a daughter board 80 is provided on the side of a resin substrate 20 housing the metallic substrate 12. Since signal lines do not pass through a dielectric layer 14, reflection caused by incomplete impedence matching due to a high dielectric and transmission delay due to passing through the high dielectric are prevented.</p> |
