发明名称 LAMINATED CHIP INDUCTOR
摘要 PROBLEM TO BE SOLVED: To provide a laminated chip inductor having superior impedance characteristic at high frequencies, using for a magnetic material layer where an upper and a lower pattern are connected through a conductor through-hole, a magnetic material sheet which can be formed easily and has a good connection reliability inside the conductor through-hole. SOLUTION: In a laminated chip inductor, a stacked body of a plurality of relatively thin magnetic material sheets 1a, which can be manufactured easily and has a few detects, is used for a magnetic material layers 1a where an upper and a lower pattern 2 are connected via a conductor through-hole 3. There is also a distance formed between the conductor pattern 2, suppressing decline in the impedance at high frequencies of 500 MHz or higher.
申请公布号 JP2001023823(A) 申请公布日期 2001.01.26
申请号 JP19990195608 申请日期 1999.07.09
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 MORIMOTO TAKEKI;URYU HIDEKAZU;WASHISAKI TOMOYUKI;NAKAMORI TATSUYA
分类号 H01F17/00;(IPC1-7):H01F17/00 主分类号 H01F17/00
代理机构 代理人
主权项
地址