| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a resin-encapsulated semiconductor device which yields high productivity, low cost and good quality, and in which stresses inside the molding generated by warpage corrections of the molding in a cutting process can be reduced, and a lead frame thereof. SOLUTION: A lead frame 4 having openings 10 on outer peripheries of a plurality of chip-mounting regions Rcp is provided, on which electrode pads of semiconductor chips 2 and signal connection terminals 1 are connected electrically. A sealing sheet 6 is placed between a metal mold plane that faces the concave cavity of a metal mold 15 and the backside of the lead frame 4. The body 20 to be molded is placed in the concave cavity 14, which is filled with a resin 7 and is sealed up to the openings 10 of the lead frame 4. The sealing sheet 6 is peeled off, while the molding is pressed and heated to cure the resin, and is cut into individual devices. |
