| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive for manufacturing a high-reliability super dense semiconductor device with a low cost, which is superior in adhesiveness, storage property, stability and workability, and is capable of reducing thermal stresses in the semiconductor device generated during assembly and use of the semiconductor device. SOLUTION: This adhesive is a flexible and strong adhesive 26 for a semiconductor device, containing 5-70 weight % of spherical silica having hydroxyl groups and pre-treated by a coupling agent. Extremely superior characteristics in adhesiveness, storage property, and workability are obtained by containing a proper quantity of coupling-agent treated silica, having an optimum grain diameter as a solid adhesive component. Characteristics of the spherical silica, having hydroxyl groups include average diameter of 0.1-5 μm, CV value of 60% or smaller, and hydroxyl group quantity of 0.01-1.0 mmol/g. The coupling agent has a functional group capable of reacting with base resin, and its preferable usage quantity is 1/5-1/1 of theoretical coverage quantity. Preferable base resin is a silicone-based, flexible epoxy-based, or elastomer-based flexible adhesive. |
