发明名称 COMPONENT MOUNTING EQUIPMENT AND METHOD
摘要 PROBLEM TO BE SOLVED: To reduce time for moving a component mounting position to a substrate by a head by adding a rotation component at a rotary part in addition to a traveling component at an XY table for moving a rotary part that is rotated around an axis center vertical to the mounting surface of the substrate for each retention part in XY directions. SOLUTION: A printed-circuit board 1 is retained by a retention part 2 in a substrate-moving device 6, the retention part 2 is arranged on a rotary part 3 and is rotated around a rotary axis center 5 that is vertical to the component mounting surface by the rotary part 3. The rotary axis center 5 is located at a fixed position when viewed from an area on the printed-circuit board 11. The rotary part 3 is arranged on the XY table 4, and the entire circuit 3 is configured so that it can travel in XY directions. When the printed-circuit board 1 is rotated around the rotary axis center 5, a next part-mounting position can be moved on a circumference 7 with the distance to the rotary axis center 5 as a rotary radius and can be moved to a point that is closest to the component mounting position immediately before on the circumference 7.
申请公布号 JP2001024396(A) 申请公布日期 2001.01.26
申请号 JP19990198771 申请日期 1999.07.13
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 FUJIWARA HIROAKI;HANADA KEIJI
分类号 H05K13/04 主分类号 H05K13/04
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