| 摘要 |
PROBLEM TO BE SOLVED: To connect a lead frame electrode and a pad electrode easily even when the lead frame electrodes are arranged at a fine pitch by connecting a first lead frame electrode serving as an external pin with a pad electrode on a semiconductor substrate through a second lead frame electrode interposed between them. SOLUTION: Using lead frame electrodes J1-J4 not used as an external pin, an outer terminal E2 is connected with a semiconductor device through a lead frame electrode F2, the lead frame electrode F2 is connected with the lead frame electrode J1 by wire bonding G2, and the lead frame electrode J1 is connected with a pad electrode H2 on a semiconductor substrate β2 by wire bonding G2. Similarly, other outer terminal E10, E13, E21 is connected with pad electrode H10, H13, H21 through a lead frame electrode F10, F13, F21. According to the arrangement, a lead frame electrode and a pad electrode can be connected easily even when the lead frame electrodes are arranged at a fine pitch. |
